This industry must always keep up with dramatically changing trends or generational changes of products like BGA for MPU, IC package peripheral circuit and COF for LCD driver ICs. Our high precise writing machines never disappoint any customers. We have been adjusting ourselves to rapidly changing environment. The more segmented and sophisticated products and more precise patterning are required, the more reasons you will find to choose Nippon Filcon's photomasks.
Printed circuit boards/ BUMP/ TSV/ COF/ etc
|Substrate||Material||Magnification ratio||Applicable device|
|7×7×0.12inch||Quartz||1× , Others||USHIO, EVG, ORC, TOPCON,
MEJIRO PRECISION etc.
|Minimum dimension||Guaranteed minimum dimension||Positioning accuracy||Guaranteed defect accuracy|
|0.7µm||0.7µm||±0.15µm ~||0 def.sq cm, 1µm