This industry must always keep up with dramatically changing trends or generational changes of products like BGA for MPU, IC package peripheral circuit and COF for LCD driver ICs. Our high precise writing machines never disappoint any customers. We have been adjusting ourselves to rapidly changing environment. The more segmented and sophisticated products and more precise patterning are required, the more reasons you will find to choose Nippon Filcon's photomasks.
Printed circuit boards/ BUMP/ TSV/ COF/ etc
Substrate | Material | Magnification ratio | Applicable device |
---|---|---|---|
7×7×0.12inch | Quartz | 1× , Others | USHIO, EVG, ORC, TOPCON, MEJIRO PRECISION etc. |
9×9×0.12/0.2inch | |||
508×609.6×4.8mm | Soda lime | 1× |
Other various substrates can also be accommodated.
Quartz/Soda lime mask size up to 813mm×813mm (1×) available.
Minimum dimension | Guaranteed minimum dimension | Positioning accuracy | Guaranteed defect accuracy |
---|---|---|---|
0.7µm | 0.7µm | ±0.15µm ~ | 0 def.sq cm, 1µm or bigger |